Top articles published this week include an interview series with Robert Ewing of the Pacific Northwest National Laboratory, a news article on using infrared (IR) cameras to see invisible methane leaks, and an article about the role of vibrational spectroscopy in analyzing plant-based food products.

In Part II of our three-part interview with Robert Ewing, he reviews the results of the Nogales border test.

Researchers at Heilongjiang University have developed a rapid and accurate method for detecting sweeteners in food using Raman spectroscopy combined with a Random Forest machine learning algorithm, offering a powerful tool for improving food safety.

Experts explore the evolving role of CDMOs in semiconductor fabrication and why strategic partnerships are increasingly critical for process innovation and cost control.

Looking ahead, panelists discuss emerging technologies, new analytical frontiers, and future regulatory pressures shaping semiconductor manufacturing over the next decade.

The panel takes a deep dive into total chemical and gas management (TCGM) strategies, and the growing need for online, real-time monitoring to protect yield and safety.

Panelists discuss cutting-edge advances in monitoring ultra-pure water (UPW) purity, from ICP-MS to online pre-concentration, and the growing push for sub-ppt-level contaminant detection.

The panelists discuss the vital role of ultra-pure water (UPW) and recycled water strategies to support yield, safety, and environmental compliance.

The panel discusses how silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) materials influence semiconductor design choices, yield challenges, and supply chain risks.

This episode takes a look at the evolving regulatory environment in semiconductor manufacturing, including stricter contamination standards and the challenges of global compliance.

The panelists consider non-destructive wafer analysis using TXRF and complementary methods, and how combining techniques enables advanced defect and contamination mapping.

In this episode, the panel focuses on automation in semiconductor analysis, including sample prep innovations and the unique capabilities of next-generation ICP-MS systems.

The panel compares traditional ATD-GC-MS methods to emerging TOF-MS approaches for impurity and defect analysis, emphasizing speed and sensitivity advancements.

The panelists discuss the different techniques used for testing semiconductor materials—such as ICP-MS, VPD, GDI, and GED-ICP-MS—including which approaches the industry will adopt more moving forward.