Spectroscopy at the Core: Overcoming Efficiency and Purity Challenges in Semiconductor Fabrication

As semiconductor technology advances, manufacturers face mounting pressure to enhance efficiency while maintaining ultra-high purity standards. In a recent Spectroscopy Peer Exchange™, leading experts from Covalent Metrology, PerkinElmer, IAS, and Linde discussed the top challenges facing semiconductor fabricators in 2025. From supply chain disruptions to the evolution of analytical instrumentation, the conversation highlighted the critical role of spectroscopy in navigating the industry's future.

Supply Chain Disruptions and Talent Gaps

Fuhe Lee, vice president and general manager at Covalent Metrology, opened the discussion by highlighting the impact of geopolitical instability on the semiconductor supply chain. Critical materials such as rare earth elements and specialized OEM tools have seen delivery delays and shortages, creating bottlenecks in production. Compounding the issue is a widening talent gap, particularly in high-tech hubs like Silicon Valley, which has slowed innovation and increased operational strain.

Purity Demands and Contamination Control

As chip sizes shrink, the demand for ultra-pure materials intensifies. Ruth Merrifield of PerkinElmer emphasized the importance of minimizing contamination during raw material handling. Even minor impurities can compromise device performance, making precision and cleanliness paramount. The panel agreed that achieving these purity levels requires not only advanced instrumentation, but also rigorous process controls and automation.

Katsu Kawabata, chairman of IAS, raised concerns about the potential regulatory restrictions on perfluoroalkoxy (PFA) materials, which are essential for handling corrosive chemicals like hydrofluoric acid. Without viable alternatives, such regulations could severely impact semiconductor production.

A technician with a semiconductor wafer. © ryanking999

Instrumentation Evolution: From Wafer to Gas Analysis

The panel explored how semiconductor manufacturing equipment is evolving to meet new demands. Kawabata noted a shift toward real-time, inline monitoring systems capable of detecting trace metal contaminants in liquid chemicals and gases. In Taiwan and China, fabs are increasingly adopting online chemical monitoring systems to assess impurities in bulk chemical tanks and delivery trucks.

Merrifield added that interoperability between instruments is becoming crucial. Collaborative systems that talk to each other streamline workflows and reduce human error, enhancing both efficiency and precision.

Emerging Techniques: ICP-MS, VPD, and GED

A major focus of the discussion was the role of inductively coupled plasma mass spectrometry (ICP-MS) in semiconductor analysis. Techniques like vapor phase decomposition (VPD) and gas exchange devices (GED) are gaining traction for their ability to detect trace metals in wafers and gases.

Kawabata described IAS’s novel laser ablation system, which eliminates the need for enclosed cells and enables direct wafer analysis. This approach, combined with GED, allows for real-time particle detection in argon gas streams, offering a powerful alternative to traditional VPD methods—especially for challenging materials like silicon carbide and gallium nitride.

Murphy and Merrifield agreed that GED represents a promising frontier for gas-phase analysis, particularly for corrosive gases. However, they cautioned that safety protocols and interference management must evolve alongside these technologies.

Automation and Continuous Manufacturing

Automation is revolutionizing sample preparation and introduction systems. Merrifield highlighted how automated workflows reduce human contact, minimizing contamination risks and improving reproducibility. In cleanroom environments, where even a single particle can compromise a chip, automation ensures consistent quality and supports continuous manufacturing.

Lee added that automated systems enable real-time data flow, facilitating faster decision-making and tighter process control. This is especially critical as fabs strive to maintain high yields while scaling production.

Regulatory Pressures and Analytical Innovation

The panel also discussed the evolving regulatory landscape. Merrifield discussed the Semiconductor Equipment Communication Standard (SEMI SECS/GEM), which mandates compliance for online instrumentation integration. Meanwhile, Lee emphasized the growing need for standardized metrology, particularly for nanoparticle detection.

Nanoparticles, along with trace metals, organics, and native oxides, are increasingly recognized as leading causes of yield loss. Lee stressed that without reliable monitoring tools, fabs cannot control these contaminants. Acoustic spectroscopy and ellipsometry are emerging as key techniques for detecting sub-nanometer native oxide layers and subsurface defects.

Kawabata echoed these concerns, noting that conventional techniques like TXRF may lack the sensitivity required for next-generation chips. Laser ablation ICP-MS and time-of-flight secondary ion mass spectrometry (TOF-SIMS) offer deeper profiling and elemental imaging capabilities, making them indispensable for future semiconductor analysis.

The Water Challenge: Purity, Recycling, and PFAS

Water usage in semiconductor fabs is staggering—up to 2000 liters per chip. As sustainability becomes a priority, fabs are increasingly relying on recycled water. Merrifield explained that separating waste streams and tailoring purification methods to specific contaminants is key to maintaining ultra-pure water (UPW) standards.

PFAS detection and removal remain a major hurdle. With global regulations tightening, liquid chromatography-tandem mass spectrometry (LC-MS/MS) is the preferred technique for ultra-trace analysis. However, instrument design must evolve to prevent background contamination and ensure accurate results.

Lee shared that SEMI committees are debating whether to lower UPW metal limits to 0.1 ppt. While desirable, current ICP-MS instruments struggle to meet this threshold without pre-concentration. Kawabata introduced IAS’s new online pre-concentration system, capable of processing 1,000 liters of UPW and detecting single parts-per-quadrillion (ppq) levels—an innovation that could redefine industry standards.

Total Chemical and Gas Management: In-House vs. Outsourced

Managing high-purity chemicals and gases is a balancing act between cost, control, and risk. Merrifield noted that online monitoring systems offer immediate feedback, reducing downtime and contamination risks. However, these systems require regular maintenance and calibration to remain effective.

Lee observed a trend toward strategic outsourcing, with fabs partnering with contract labs for metrology and analytical support. These collaborations allow process engineers to focus on core manufacturing tasks while leveraging external expertise for complex analyses. The result is faster innovation and more efficient resource allocation.

Looking Ahead: The Future of Semiconductor Spectroscopy

As the industry moves toward 3 nm and smaller nodes, the demand for advanced spectroscopy techniques will only grow. Lee predicted increased adoption of TOF-SIMS, ellipsometry, and acoustic spectroscopy for defect detection and compositional analysis. Kawabata emphasized the need for deeper profiling tools to analyze multi-layered devices.

Regulatory compliance, particularly around PFAS and nanoparticle control, will remain a challenge. Merrifield stressed the importance of global harmonization and traceability standards to ensure consistent quality across the supply chain.

The panelists agreed that collaboration, innovation, and precision will define the next decade of semiconductor fabrication. Spectroscopy will play a central role in this evolution, enabling manufacturers to meet the demands of tomorrow’s technology with confidence.

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