
Hybrid Wafer Metrology for Bump Inspection and Overlay Control in Semiconductor Device Manufacturing
Monday, November 14th, 2022 at 11am EST|8am PST|6pm IST Join us for this web seminar to learn about advanced hybrid metrology to optimize semiconductor R&D and high-volume manufacturing processes, including bump inspection in thin-film analysis, and thickness and composition measurements of AgSn micro solder bumps using a monochromatic micro X-ray beam.











