TXRF: Benefits of Non-Destructive Techniques
The panelists consider non-destructive wafer analysis using TXRF and complementary methods, and how combining techniques enables advanced defect and contamination mapping.
Wafer integrity and surface purity are critical for device performance. This episode examines TXRF's role alongside VPD-ICP-MS and laser ablation, balancing mapping capabilities with sensitivity to meet stringent fab demands.
Key discussion topics include:
- The trade-offs between non-destructive and destructive analytical methods.
- Advantages of combining TXRF mapping with high-sensitivity ICP-MS.
- How laser ablation supports edge and depth-resolved analyses.
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