Feature|Videos|July 9, 2025
TXRF: Benefits of Non-Destructive Techniques
The panelists consider non-destructive wafer analysis using TXRF and complementary methods, and how combining techniques enables advanced defect and contamination mapping.
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Episodes in this series
Wafer integrity and surface purity are critical for device performance. This episode examines TXRF's role alongside VPD-ICP-MS and laser ablation, balancing mapping capabilities with sensitivity to meet stringent fab demands.
Key discussion topics include:
- The trade-offs between non-destructive and destructive analytical methods.
- Advantages of combining TXRF mapping with high-sensitivity ICP-MS.
- How laser ablation supports edge and depth-resolved analyses.
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